Electronic and Assembly Materials
In today's rapidly changing electronics industry, it's not easy to find a partner who can keep pace with the production of state-of-the-art products pursued by customers. Bondy adhesive research team continues to study technology on next-generation products, providing solutions that customers can trust and depend on.
Applications
Metallic adhesion
Adhesion line which provides strong adhesion to the metal. It is excellent for heat and cold.
Semiconductor
Adhesion lines for various semiconductor applications. Heat seals, surface mount devices (SMD), conformal coatings, bags, pocapsulations
Exterior Housing
It's an assembly bond. Adhesive solution suitable for housing of plastic and metal from a filling agent. It is excellent for heat resistance and cold cooling, and its durability improves product stability.
We offer ready-made or customized products for your application. Bondy adhesive research team will provide you with an adhesive study for your satisfaction.
bondy technology
Just-Melt
This technology has been improved to melt the glue itself from the packaging used in the past. This is DY's unique adhesive packaging technique that helps customers to enjoy the convenience of using the adhesive film.
Coolow
It is a low-application adhesive technology that works at low temperatures (120°C to 140°C). Effective on penetrance-based materials, good for wetting and absorption. This adhesive solution helps the high speed production.